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Solvay adds 10% carbon fiber filled KetaSpire PEEK and neat Radel PPSU to e-Xstream’s latest release (2019.0) of Digimat- AM software. (Photo: e-Xstream engineering)
Solvay adds 10% carbon fiber filled KetaSpire PEEK and neat Radel PPSU to e-Xstream’s latest release (2019.0) of Digimat- AM software. (Photo: e-Xstream engineering)

Solvay adds 10% carbon fiber filled KetaSpire polyetheretherketone (PEEK) and neat Radel polyphenylsulfone (PPSU) to e-Xstream engineering’s latest release (2019.0) of Digimat-Additive Manufacturing (AM) software.

These products complement the neat KetaSpire PEEK AM filament already available for simulation on e-Xstream engineering’s Digimat-AM platform.

These new materials will benefit from e-Xstream engineering’s Digimat-AM Advanced Solver. This software offers highly accurate, predictive modelling data for Solvay’s AM filaments over a wide range of critical characteristics, including detailed warpage and residual stress, to help designers and engineers optimize the process and minimize part deformation before printing.

For highly demanding applications, Digimat further enables design validation by predicting the printed part performance (stiffness, strength, etc.) as a function of the material and the printing process parameters.

Our growing range of AM filaments underscores Solvay’s determination to establish itself as an industry leader in this rapidly evolving market,” says Christophe Schramm, Additive Manufacturing business manager in the company’s Specialty Polymers global business unit.

“As a result of our partnership, we bridge the gap in simulation engineering between high-performance polymers and demanding printing processes such as Fused Filament Fabrication,” adds Roger Assaker, CEO of e-Xstream engineering and Chief Material Strategist for MSC Software.

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