Dow Corning has introduced the new Dow Corning TC-4525 Thermally Conductive Gap Filler for automotive electronics applications.

The new silicone technology delivers thermal conductivity of 2.5W/m.K, with improved dispensability and reduced abrasiveness, according to the company.

"Our goal was to enable customers to cost-effectively manage the rising heat in their next-generation electronics designs," said Brice Le Gouic, Global Market Manager for Transportation Electronics, Dow Corning. "While dense, high-functioning electronic assemblies deliver greater value to automotive safety, reliability, performance and comfort, they are also generating higher temperatures that can reduce device performance and reliability over time."

TC-4525 Thermally Conductive Gap Filler is a soft, compressible, two-part silicone that can be dispensed directly from its original packaging without much additional process preparation.

The material's superior thixotropic properties enable it to dispense easily, avoid slumping on vertical surfaces during assembly and after cure, maintain its vertical stability even after long use.

Dow Corning offers an optional formulation that incorporates glass beads to control bond line thickness during assembly, allowing the material to deliver lower abrasiveness to lower friction and help reduce maintenance.

The platinum cure system of Dow Corning's new gap filler enables fast, controlled cure at room temperature, although cure times can be accelerated further with heat to reduce manufacturing cycle times. It requires no post-cure steps, withstands peak exposure at 200°C and performs reliably at operating temperatures up to 150°C.

Dow Corning has introduced the new Dow Corning TC-4525 Thermally Conductive Gap Filler for automotive electronics applications.

The new silicone technology delivers thermal conductivity of 2.5W/m.K, with improved dispensability and reduced abrasiveness, according to the company.

"Our goal was to enable customers to cost-effectively manage the rising heat in their next-generation electronics designs," said Brice Le Gouic, Global Market Manager for Transportation Electronics, Dow Corning. "While dense, high-functioning electronic assemblies deliver greater value to automotive safety, reliability, performance and comfort, they are also generating higher temperatures that can reduce device performance and reliability over time."

TC-4525 Thermally Conductive Gap Filler is a soft, compressible, two-part silicone that can be dispensed directly from its original packaging without much additional process preparation.

The material's superior thixotropic properties enable it to dispense easily, avoid slumping on vertical surfaces during assembly and after cure, maintain its vertical stability even after long use.

Dow Corning offers an optional formulation that incorporates glass beads to control bond line thickness during assembly, allowing the material to deliver lower abrasiveness to lower friction and help reduce maintenance.

The platinum cure system of Dow Corning's new gap filler enables fast, controlled cure at room temperature, although cure times can be accelerated further with heat to reduce manufacturing cycle times. It requires no post-cure steps, withstands peak exposure at 200°C and performs reliably at operating temperatures up to 150°C.