X2F has joined collaboration with Covestro to develop a thermally conductive automotive heat-sink with in-mold electronics using X2F’s transformative controlled viscosity molding technology. Application samples will be displayed at Covestro’s booth at K 2022.

This new product will be a unique alternative for automotive OEMs and processors who seek a replacement for cast aluminum heat-sinks that is both lighter and more affordable.

The new heat-sink molded of Covestro's Makrolon polycarbonate (PC) is approximately half as heavy as the typical aluminum part. It is part of an in-mold assembly that can be used to integrate LED modules directly into the headlamp housing, eliminating the weight and labor associated with the installation of brackets, screws, thermal pastes, and adhesives. 

The X2F technology is production-ready and has been demonstrated in high-volume series manufacturing for other applications.

Covestro continues to pioneer the use of in-mold electronics (IME) coupled with the heat management that Makrolon TC polycarbonate provides.

The thermally conductive polycarbonate heat-sink can be 49% lighter than cast aluminum.

"This new program involves using controlled viscosity molding by X2F to attach the LED module directly onto the thermally conductive heat-sink without fundamentally changing the heat-sink adjuster module design," said Paul Platte, Senior Marketing Manager, Covestro LLC. "We are pleased with the outcome so far of the X2F project where we have recently seen enhanced thermal management performance compared to traditional injection-molded processes."

X2F’s process enables sensitive electronics to be insert molded, thus providing functional integration, heat management, modularity, and miniaturization. 

"This innovative technology enables the manufacture of previously impossible-to-mold thermoplastic parts that provide step-change improvements for our customers.  In the case of heat-sinks, it dramatically streamlines production, reduces manufacturing times, eliminates fasteners and pastes, and increases product design flexibility," stated Reza Garaee, senior project manager at X2F.

X2F’s ability to mold thermally conductive materials has applications far beyond heat-sinks. Thermal management is critical for superior performance in batteries, motors, and printed circuit board applications.

The X2F controlled viscosity, low-pressure molding approach allows highly filled materials to be molded that are currently not possible with other manufacturing approaches. The result is 30-200% improvement in performance depending on the application and materials used.

In addition, X2F recently added a rotary table which reduces cycle times and opens up higher-volume production for its controlled viscosity molding machine.

The rotary table enables X2F to reach production volumes of up to four million parts per year with one unit, depending on the cycle time, for the manufacture of critical components in the electronics, automotive, industrial, and medical industries.

X2F has joined collaboration with Covestro to develop a thermally conductive automotive heat-sink with in-mold electronics using X2F’s transformative controlled viscosity molding technology. Application samples will be displayed at Covestro’s booth at K 2022.

This new product will be a unique alternative for automotive OEMs and processors who seek a replacement for cast aluminum heat-sinks that is both lighter and more affordable.

The new heat-sink molded of Covestro's Makrolon polycarbonate (PC) is approximately half as heavy as the typical aluminum part. It is part of an in-mold assembly that can be used to integrate LED modules directly into the headlamp housing, eliminating the weight and labor associated with the installation of brackets, screws, thermal pastes, and adhesives. 

The X2F technology is production-ready and has been demonstrated in high-volume series manufacturing for other applications.

Covestro continues to pioneer the use of in-mold electronics (IME) coupled with the heat management that Makrolon TC polycarbonate provides.

The thermally conductive polycarbonate heat-sink can be 49% lighter than cast aluminum.

"This new program involves using controlled viscosity molding by X2F to attach the LED module directly onto the thermally conductive heat-sink without fundamentally changing the heat-sink adjuster module design," said Paul Platte, Senior Marketing Manager, Covestro LLC. "We are pleased with the outcome so far of the X2F project where we have recently seen enhanced thermal management performance compared to traditional injection-molded processes."

X2F’s process enables sensitive electronics to be insert molded, thus providing functional integration, heat management, modularity, and miniaturization. 

"This innovative technology enables the manufacture of previously impossible-to-mold thermoplastic parts that provide step-change improvements for our customers.  In the case of heat-sinks, it dramatically streamlines production, reduces manufacturing times, eliminates fasteners and pastes, and increases product design flexibility," stated Reza Garaee, senior project manager at X2F.

X2F’s ability to mold thermally conductive materials has applications far beyond heat-sinks. Thermal management is critical for superior performance in batteries, motors, and printed circuit board applications.

The X2F controlled viscosity, low-pressure molding approach allows highly filled materials to be molded that are currently not possible with other manufacturing approaches. The result is 30-200% improvement in performance depending on the application and materials used.

In addition, X2F recently added a rotary table which reduces cycle times and opens up higher-volume production for its controlled viscosity molding machine.

The rotary table enables X2F to reach production volumes of up to four million parts per year with one unit, depending on the cycle time, for the manufacture of critical components in the electronics, automotive, industrial, and medical industries.