Cicor Group, a leading manufacturer of printed circuit boards and hybrid circuits, has selected SABIC’s LNP THERMOCOMP compounds with laser direct structuring (LDS) capability to produce high-end, three-dimensional molded interconnect devices (3D-MIDs).

Building on a longstanding relationship, Cicor and SABIC collaborated to meet multiple, stringent requirements for sophisticated devices used in 5G networking, automotive and consumer electronics applications.

SABIC’s portfolio of LNP THERMOCOMP compounds delivers good flow for thin walls used in miniaturized designs, optimized LDS performance to achieve uniform fine-pitch circuit patterns and high heat resistance for use in the surface mount technology (SMT) assembly process.

“SABIC is a pioneer in materials that enable laser direct structuring, which is critical for producing highly integrated electronics that save precious space in smaller and thinner electronic devices,” said Joshua Chiaw, Director, Business Management, LNP & NORYL, Specialties, SABIC. “As 3D-MID technology rapidly advanced and Cicor looked to innovate the design of its products to gain higher performance and precision, SABIC was able to meet the company’s needs.”

Cicor Group has selected SABIC’s LNP THERMOCOMP compounds with laser direct structuring capability to produce high-end, three-dimensional molded interconnect devices.

“As we explored the use of liquid crystal polymers for our fine-pitch 3D-MID products, we quickly found that SABIC’s LNP THERMOCOMP compounds, which are based on LCPs, far surpassed competitive offerings in the uniformity and precision of circuit traces, and were clearly the solution that could best fit our needs,” said HS Song, Managing Director, China, Suzhou Cicor Technology Co., Ltd. “These materials also help us optimize yield rates to drive down total system costs.”

Innovative Material Technology for MIDs

Molded interconnect devices integrate electronic and mechanical functions in a single, three-dimensional package to save space and weight compared to traditional printed circuit boards (PCBs).

These high-precision, miniaturized devices help address rigorous demands for higher performance in smaller form factors that are arising from the implementation of 5G infrastructure and 5G-enabled applications. For instance, 5G networking in cities requires many small cell towers, placed close together, to deliver faster data transmission while remaining unobtrusive.

SABIC’s LDS-enabled LNP THERMOCOMP materials can play an important role in designing and manufacturing high-end MIDs. The performance enables manufacturers to create fine-pitch devices, which are distinguished by very narrow spacing (<200 microns) between leads and highly complex patterns.

SABIC materials used to mold these devices incorporate laser-activated additives that allow conductive traces to be produced on the surface of the part, and then metallized using electroless technology. These grades deliver precise and uniform metallization of these critical circuit traces. They also offer low, stable dielectric constant (Dk) and dissipation (Df) properties.

Very good flow properties (10 to 100 times better than that of other polymers), combined with dimensional stability, enable LNP THERMOCOMP compounds to be used for molding thin-wall parts that are less than 0.5 mm. The materials’ high flow also helps to accelerate throughput.

Previously, Cicor used high-performance semi-crystalline materials for its MIDs. However, as MID specifications became increasingly demanding, Cicor required the unique properties of SABIC’s LNP THERMOCOMP compounds.

Compared to the incumbent polymers, SABIC’s LNP THERMOCOMP compounds offer better dimensional stability, which helps to reduce warpage and improve design precision. Another advantage is their elevated temperature resistance for undergoing SMT, which is much higher than that of other polymers.

“SABIC delivered a solution to address Cicor’s requirements for high-performance specialty materials that can handle the rigorous demands placed on automotive, telecommunications and consumer electronic components,” added Jenny Wang, Director, Formulation & Application Development, APAC, Specialties, SABIC. “These applications require smaller, thinner form factors, incorporation of more functionality and the ability to withstand high-heat processes. Our LNP products are equal to this challenge.”

Cicor Group, a leading manufacturer of printed circuit boards and hybrid circuits, has selected SABIC’s LNP THERMOCOMP compounds with laser direct structuring (LDS) capability to produce high-end, three-dimensional molded interconnect devices (3D-MIDs).

Building on a longstanding relationship, Cicor and SABIC collaborated to meet multiple, stringent requirements for sophisticated devices used in 5G networking, automotive and consumer electronics applications.

SABIC’s portfolio of LNP THERMOCOMP compounds delivers good flow for thin walls used in miniaturized designs, optimized LDS performance to achieve uniform fine-pitch circuit patterns and high heat resistance for use in the surface mount technology (SMT) assembly process.

“SABIC is a pioneer in materials that enable laser direct structuring, which is critical for producing highly integrated electronics that save precious space in smaller and thinner electronic devices,” said Joshua Chiaw, Director, Business Management, LNP & NORYL, Specialties, SABIC. “As 3D-MID technology rapidly advanced and Cicor looked to innovate the design of its products to gain higher performance and precision, SABIC was able to meet the company’s needs.”

Cicor Group has selected SABIC’s LNP THERMOCOMP compounds with laser direct structuring capability to produce high-end, three-dimensional molded interconnect devices.

“As we explored the use of liquid crystal polymers for our fine-pitch 3D-MID products, we quickly found that SABIC’s LNP THERMOCOMP compounds, which are based on LCPs, far surpassed competitive offerings in the uniformity and precision of circuit traces, and were clearly the solution that could best fit our needs,” said HS Song, Managing Director, China, Suzhou Cicor Technology Co., Ltd. “These materials also help us optimize yield rates to drive down total system costs.”

Innovative Material Technology for MIDs

Molded interconnect devices integrate electronic and mechanical functions in a single, three-dimensional package to save space and weight compared to traditional printed circuit boards (PCBs).

These high-precision, miniaturized devices help address rigorous demands for higher performance in smaller form factors that are arising from the implementation of 5G infrastructure and 5G-enabled applications. For instance, 5G networking in cities requires many small cell towers, placed close together, to deliver faster data transmission while remaining unobtrusive.

SABIC’s LDS-enabled LNP THERMOCOMP materials can play an important role in designing and manufacturing high-end MIDs. The performance enables manufacturers to create fine-pitch devices, which are distinguished by very narrow spacing (<200 microns) between leads and highly complex patterns.

SABIC materials used to mold these devices incorporate laser-activated additives that allow conductive traces to be produced on the surface of the part, and then metallized using electroless technology. These grades deliver precise and uniform metallization of these critical circuit traces. They also offer low, stable dielectric constant (Dk) and dissipation (Df) properties.

Very good flow properties (10 to 100 times better than that of other polymers), combined with dimensional stability, enable LNP THERMOCOMP compounds to be used for molding thin-wall parts that are less than 0.5 mm. The materials’ high flow also helps to accelerate throughput.

Previously, Cicor used high-performance semi-crystalline materials for its MIDs. However, as MID specifications became increasingly demanding, Cicor required the unique properties of SABIC’s LNP THERMOCOMP compounds.

Compared to the incumbent polymers, SABIC’s LNP THERMOCOMP compounds offer better dimensional stability, which helps to reduce warpage and improve design precision. Another advantage is their elevated temperature resistance for undergoing SMT, which is much higher than that of other polymers.

“SABIC delivered a solution to address Cicor’s requirements for high-performance specialty materials that can handle the rigorous demands placed on automotive, telecommunications and consumer electronic components,” added Jenny Wang, Director, Formulation & Application Development, APAC, Specialties, SABIC. “These applications require smaller, thinner form factors, incorporation of more functionality and the ability to withstand high-heat processes. Our LNP products are equal to this challenge.”