Search History
Clear History
{{item.search_key}}
Hot Searches
Change
{{item.name}}
{{item.english_name}}
Subscribe eNews
Once A Week Once Every Two Weeks
{{sum}}
Login Register

Applications

OQ brings expanded PP and PE portfolio to CHINAPLAS 2026

World’s first pilot project of solvent-based recycling of waste HDPE signed in Shanghai

Starlinger debuts PP*STAR® pinch bottom conversion technology

Products

SUDARSHAN stays customer-centric to meet premiumization trend

Record-high visitors at CHINAPLAS: Plastics solutions for new racetracks

Chen Hsong’s new multi-material solution sets new benchmark for green manufacturing

Activities

  • 350,000+ visitors! CHINAPLAS 2026 shatters every record in the book

  • CHINAPLAS 2026: 86,504 visitors explore innovations on Day 3

  • Must-attend events: Application in Focus and Additives Seminar

Pictorial

News Videos

MAAG x SIKORA: Smart pelletizing + precise inspection - More stable, carbon-reduced

CAI Machine: New visual inspection technology debut! More efficient, greener, colorful printing

Ready for CHINAPLAS 2026? Two tools for your visit

Conference Videos

[Mandarin session: Highlights] Covestro: Innovative thermal conductive material solution for new-generation network devices

[Mandarin session: Highlights] Covestro: The Material Effect: Empowering Innovations in Solar-Storage-Charging Smart Energy and Data Center Applications

[Mandarin session: Highlights] Covestro: In-mold Coating (DC/IMC) Technology - Facilitating Personalized Design for Automotive Interior and Exterior Components

Corporate/Product Videos

About Dow

B Series brush machine

Innovative PVC Compounds for Global Manufacturing | Visit Us Booth 6.2A 39 at CHINAPLAS

Home > News > E&E

Avient expands 5G material portfolio with low-loss dielectric thermoplastics

Source:Adsale Plastics Network Date :2021-07-30 Editor :JK

Avient has added PREPERM low-loss dielectric thermoplastics to its growing portfolio of materials serving the needs of emerging 5G applications.

 

Devices that rely on 5G are sparking innovation in industries ranging from telecommunications and consumer electronics to automotive and healthcare. The devices, in turn, rely on materials that limit signal loss at high-band 5G frequencies (mmWave).

 

These high frequency, conductive materials enable faster and more reliable connections for antennas, base stations, resonators, lenses, automotive radar, IoT (Internet of Things) devices, and service providers’ equipment that directly serves end-users, such as routers and modems.


1_web.jpg

PREPERM thermoplastics are developed to support 5G applications. (Photo: Getty Images)


PREPERM thermoplastics provide stable and controlled dielectric performance plus ultra-low transmission loss at mmWave frequencies up to 220 GHz. With a dielectric constant (Dk) range spanning 2.55 to 23, the materials are optimized to boost antenna efficiency and deliver lightweight solutions for 5G devices.

 

These polymers, together with Avient’s application design and prototyping services, allow for faster prototyping and shorter lead times compared to ceramics traditionally used in telecom applications. Injection moldable and colorable, PREPERM materials are available globally.

 

“With tremendous growth forecast for 5G networks and user adoption over the next five years, design engineers and manufacturers need advanced materials that enable faster, more efficient networks,” said Matt Mitchell, global marketing director, Specialty Engineered Materials at Avient. “Preperm materials meet those challenges with better performance and lower total costs versus ceramics.”

 Like 丨  {{details_info.likes_count}}
Avient

The content you're trying to view is for members only. If you are currently a member, Please login to access this content.   Login

Source:Adsale Plastics Network Date :2021-07-30 Editor :JK

Avient has added PREPERM low-loss dielectric thermoplastics to its growing portfolio of materials serving the needs of emerging 5G applications.

 

Devices that rely on 5G are sparking innovation in industries ranging from telecommunications and consumer electronics to automotive and healthcare. The devices, in turn, rely on materials that limit signal loss at high-band 5G frequencies (mmWave).

 

These high frequency, conductive materials enable faster and more reliable connections for antennas, base stations, resonators, lenses, automotive radar, IoT (Internet of Things) devices, and service providers’ equipment that directly serves end-users, such as routers and modems.


1_web.jpg

PREPERM thermoplastics are developed to support 5G applications. (Photo: Getty Images)


PREPERM thermoplastics provide stable and controlled dielectric performance plus ultra-low transmission loss at mmWave frequencies up to 220 GHz. With a dielectric constant (Dk) range spanning 2.55 to 23, the materials are optimized to boost antenna efficiency and deliver lightweight solutions for 5G devices.

 

These polymers, together with Avient’s application design and prototyping services, allow for faster prototyping and shorter lead times compared to ceramics traditionally used in telecom applications. Injection moldable and colorable, PREPERM materials are available globally.

 

“With tremendous growth forecast for 5G networks and user adoption over the next five years, design engineers and manufacturers need advanced materials that enable faster, more efficient networks,” said Matt Mitchell, global marketing director, Specialty Engineered Materials at Avient. “Preperm materials meet those challenges with better performance and lower total costs versus ceramics.”

全文内容需要订阅后才能阅读哦~
立即订阅

Recommended Articles

E&E
World-first global supply chain for renewable plastics used in Sony’s products
 2026-02-11
E&E
More sustainable power station with bio-based Covestro materials at CES 2026
 2026-01-06
E&E
Polyplastics expands LAPEROS LCP range for electronics industry
 2025-12-24
E&E
KRAIBURG TPE’s food-safe TPE solutions for coffee makers
 2025-10-24
E&E
Eastman’s Tritan Renew used in countertop equipment
 2025-10-24
E&E
Syensqo launches low-density HPPA for consumer electronics
 2025-10-20

You May Be Interested In

Change

  • People
  • Company
loading... No Content
{{[item.truename,item.truename_english][lang]}} {{[item.company_name,item.company_name_english][lang]}} {{[item.job_name,item.name_english][lang]}}
{{[item.company_name,item.company_name_english][lang]}} Company Name    {{[item.display_name,item.display_name_english][lang]}}  

Polyurethane Investment Medical Carbon neutral Reduce cost and increase efficiency CHINAPLAS Financial reports rPET INEOS Styrolution Evonik Borouge Polystyrene (PS) mono-material Sustainability Circular economy BASF SABIC Multi-component injection molding machine All-electric injection molding machine Thermoforming machine

Avient expands 5G material portfolio with low-loss dielectric thermoplastics

识别右侧二维码,进入阅读全文
下载
x 关闭
订阅
亲爱的用户,请填写一下信息
I have read and agree to the 《Terms of Use》 and 《Privacy Policy》
立即订阅
Top
Feedback
Chat
News
Market News
Applications
Products
Video
In Pictures
Specials
Activities
eBook
Front Line
Plastics Applications
Chemicals and Raw Material
Processing Technologies
Products
Injection
Extrusion
Auxiliary
Blow Molding
Mold
Hot Runner
Screw
Applications
Packaging
Automotive
Medical
Recycling
E&E
LED
Construction
Others
Events
Conference
Webinar
CHINAPLAS
CPS+ eMarketplace
Official Publications
CPS eNews
Media Kit
Social Media
Facebook
Linkedin