Technomelt Low Pressure Molding (LPM) technology was invented some 30 years ago by Henkel (formerly called Macromelt Molding). The technology enables the quick encapsulation of delicate components by using specialized polyamides in combination with standard processing equipment and low-cost molds.

Because the material is injected at a lower pressure compared to conventional injection molding processes, and non-abrasive materials are used, risk of damage to the electronics during the encapsulation process is far lower.

Providing process advantages

The technology is particularly adept at encapsulating discrete areas in complicated assembly where wiring is attached to a printed circuit board (PCB), PCBAs and other rigid component. One reason for this is that Technomelt resins, which are all unfilled, are resistant to high stresses and at the same time very flexible.

Matthew Hayward, Global Key Account for Power & Industrial Automation at Henkel, said, “I see Technomelt as an exciting part of our Circuit-Board Protection portfolio. It offers many unique advantages that traditional potting or conformal coating is not able to provide.”

Technomelt encapsulates electronics at low pressure. After molding, parts get tested and moved to final assembly.

The encapsulating material provides very good electrical insulation, as well as resistance to a broad range of chemicals, extreme thermal cycling across high and low temperatures, and vibrations. The internal electronics are fully protected against outside elements, including ingress of water and dust, and long-term UV exposure.

"Unlike traditional two-component reactive potting compounds, the polyamides used in the Technomelt Low Pressure Molding process are single-component thermoplastics, molding cycle times are shorter, and there are no emissions of volatile," Michael Otto, Key Account Manager Engineering Adhesives for Low Pressure Molding at Henkel, explained.

Besides, Henkel Technomelt polyamide resins are compliant with the European RoHS (Restriction of Hazardous Substances) Directive and REACH (Registration, Evaluation, Authorisation and Restriction of Chemicals) regulations.

More efficient use of material

An advantage of Technomelt Low Pressure Molding over traditional potting systems is that it is much more economical in the amount of material it uses in the finished part.

With Technomelt Low Pressure Molding, the component is placed into a mold that has cavity geometry similar to that of the component, so that when the polyamide is injected, it forms a skin around the component that is more or less the same thickness at all points. This means that the amount of encapsulating material used per shot can be considerably less.

Costs of mold production are relatively low, as they are often made out of aluminum, which is much less expensive than tools made out of steel used in high-pressure injection molding. In recent years, even more cost-effective additive manufacturing techniques have also been adopted to make the molds.

Applicable to medical and healthcare fields

In addition, the Internet of Things (IOT) and Industrial Internet of Things (IIOT) depend on a foundation of sensors and associated electronic connections and components to support all sorts of devices in the home, at work, and on the move.

This trend has also lead to increased network connectivity demands for data and power cables and connectors that function in the harshest environments.

In the world of healthcare, patient diagnostics and sensing in real time require new electronic devices like wearable devices that are used in and outside of controlled medical environments. Technomelt Low Pressure Molding also responds tothese trends.

According to Jason Spencer, Henkel’s Medical Market Segment Manager, “Patient diagnostics and sensing in real time require new electronic devices that are worn in and outside of a controlled medical environment. Wearables for vital sign monitoring are becoming more important in patients’ everyday lives as healthcare becomes more digitally connected.”

For certain types of medical applications, Technomelt can also be used in applications that go beyond encapsulation of electronics. For example, it is suitable for attaching flexible tubing in liquid delivery systems, since it does not distort the tubing and provides a permanent, leakproof junction.

Henkel introduced, Loctite PA 6951, especially for this purpose. Loctite PA 6951 has been tested to Henkel’s protocols based upon ISO-10993 biocompatibility standards, with certificates available on request.

Technomelt Low Pressure Molding (LPM) technology was invented some 30 years ago by Henkel (formerly called Macromelt Molding). The technology enables the quick encapsulation of delicate components by using specialized polyamides in combination with standard processing equipment and low-cost molds.

Because the material is injected at a lower pressure compared to conventional injection molding processes, and non-abrasive materials are used, risk of damage to the electronics during the encapsulation process is far lower.

Providing process advantages

The technology is particularly adept at encapsulating discrete areas in complicated assembly where wiring is attached to a printed circuit board (PCB), PCBAs and other rigid component. One reason for this is that Technomelt resins, which are all unfilled, are resistant to high stresses and at the same time very flexible.

Matthew Hayward, Global Key Account for Power & Industrial Automation at Henkel, said, “I see Technomelt as an exciting part of our Circuit-Board Protection portfolio. It offers many unique advantages that traditional potting or conformal coating is not able to provide.”

Technomelt encapsulates electronics at low pressure. After molding, parts get tested and moved to final assembly.

The encapsulating material provides very good electrical insulation, as well as resistance to a broad range of chemicals, extreme thermal cycling across high and low temperatures, and vibrations. The internal electronics are fully protected against outside elements, including ingress of water and dust, and long-term UV exposure.

"Unlike traditional two-component reactive potting compounds, the polyamides used in the Technomelt Low Pressure Molding process are single-component thermoplastics, molding cycle times are shorter, and there are no emissions of volatile," Michael Otto, Key Account Manager Engineering Adhesives for Low Pressure Molding at Henkel, explained.

Besides, Henkel Technomelt polyamide resins are compliant with the European RoHS (Restriction of Hazardous Substances) Directive and REACH (Registration, Evaluation, Authorisation and Restriction of Chemicals) regulations.

More efficient use of material

An advantage of Technomelt Low Pressure Molding over traditional potting systems is that it is much more economical in the amount of material it uses in the finished part.

With Technomelt Low Pressure Molding, the component is placed into a mold that has cavity geometry similar to that of the component, so that when the polyamide is injected, it forms a skin around the component that is more or less the same thickness at all points. This means that the amount of encapsulating material used per shot can be considerably less.

Costs of mold production are relatively low, as they are often made out of aluminum, which is much less expensive than tools made out of steel used in high-pressure injection molding. In recent years, even more cost-effective additive manufacturing techniques have also been adopted to make the molds.

Applicable to medical and healthcare fields

In addition, the Internet of Things (IOT) and Industrial Internet of Things (IIOT) depend on a foundation of sensors and associated electronic connections and components to support all sorts of devices in the home, at work, and on the move.

This trend has also lead to increased network connectivity demands for data and power cables and connectors that function in the harshest environments.

In the world of healthcare, patient diagnostics and sensing in real time require new electronic devices like wearable devices that are used in and outside of controlled medical environments. Technomelt Low Pressure Molding also responds tothese trends.

According to Jason Spencer, Henkel’s Medical Market Segment Manager, “Patient diagnostics and sensing in real time require new electronic devices that are worn in and outside of a controlled medical environment. Wearables for vital sign monitoring are becoming more important in patients’ everyday lives as healthcare becomes more digitally connected.”

For certain types of medical applications, Technomelt can also be used in applications that go beyond encapsulation of electronics. For example, it is suitable for attaching flexible tubing in liquid delivery systems, since it does not distort the tubing and provides a permanent, leakproof junction.

Henkel introduced, Loctite PA 6951, especially for this purpose. Loctite PA 6951 has been tested to Henkel’s protocols based upon ISO-10993 biocompatibility standards, with certificates available on request.