Evonik has developed two photopolymers for industrial 3D printing applications and introduces them under the brand names INFINAM TI 3100 L and INFINAM ST 6100 L.

The two ready-to-use materials were conceptualized and invented in Evonik’s research hub in Singapore. They mark the start of a new product line of polymer resins suitable for use in common VAT polymerization technologies such as SLA or DLP.

INFINAM TI 3100 L is a high toughness light-curing resin.

“With the new product line, we are entering the market-relevant photopolymer technology stream, strengthening our long-term market position as materials experts for all major polymer-based 3D printing technologies,” said Dr. Dominic Störkle, head of the Additive Manufacturing Innovation Growth Field at Evonik.

Starting signal for a new photopolymer product line

The first high-performance material from Evonik's photopolymer product family leads to high toughness and impact-resistant 3D parts. The combination of properties makes INFINAM TI 3100 L the new standard for additive manufacturing of industrial components using VAT polymerization technologies such as SLA and DLP. The impact resistance measured on printed components is 30 J/m3 with a high elongation at break of 120%.

The new material can therefore withstand strong impact or permanent mechanical effects such as pressing or impact. The range of possible applications extends from industrial to automotive parts and individual applications in the consumer goods sector, which, in addition to design-free forms, require strong mechanical loads in object use.

Evonik’s research hub in Singapore launches new product line of photopolymers for 3D printing.

The second formulation is setting-up a new benchmark in high strength photo-resin category with a combined tensile strength of 89 MPa, flexural stress of 145 MPa and HDT of 120°C, which fills the material gap in ultra-high strength photopolymers.

These special material properties make INFINAM ST 6100 L suitable for applications which need high temperature resistance combined with high mechanical strength.

“With INFINAM TI 3100 L and INFINAM ST 6100 L we have brought the group’s first photopolymer materials for additive manufacturing to market maturity. In doing so, we draw on the enormous chemical expertise of our researchers in component development and formulation,” stated Dr. Rainer Hahn, Head of Evonik’s photopolymer market segment in the Additive Manufacturing Innovation Growth Field.

The new lines of photopolymers are ready-to-use, high-performance formulations that can be processed on a wide range of common SLA and DLP machines commercially available on the market.

Evonik has developed two photopolymers for industrial 3D printing applications and introduces them under the brand names INFINAM TI 3100 L and INFINAM ST 6100 L.

The two ready-to-use materials were conceptualized and invented in Evonik’s research hub in Singapore. They mark the start of a new product line of polymer resins suitable for use in common VAT polymerization technologies such as SLA or DLP.

INFINAM TI 3100 L is a high toughness light-curing resin.

“With the new product line, we are entering the market-relevant photopolymer technology stream, strengthening our long-term market position as materials experts for all major polymer-based 3D printing technologies,” said Dr. Dominic Störkle, head of the Additive Manufacturing Innovation Growth Field at Evonik.

Starting signal for a new photopolymer product line

The first high-performance material from Evonik's photopolymer product family leads to high toughness and impact-resistant 3D parts. The combination of properties makes INFINAM TI 3100 L the new standard for additive manufacturing of industrial components using VAT polymerization technologies such as SLA and DLP. The impact resistance measured on printed components is 30 J/m3 with a high elongation at break of 120%.

The new material can therefore withstand strong impact or permanent mechanical effects such as pressing or impact. The range of possible applications extends from industrial to automotive parts and individual applications in the consumer goods sector, which, in addition to design-free forms, require strong mechanical loads in object use.

Evonik’s research hub in Singapore launches new product line of photopolymers for 3D printing.

The second formulation is setting-up a new benchmark in high strength photo-resin category with a combined tensile strength of 89 MPa, flexural stress of 145 MPa and HDT of 120°C, which fills the material gap in ultra-high strength photopolymers.

These special material properties make INFINAM ST 6100 L suitable for applications which need high temperature resistance combined with high mechanical strength.

“With INFINAM TI 3100 L and INFINAM ST 6100 L we have brought the group’s first photopolymer materials for additive manufacturing to market maturity. In doing so, we draw on the enormous chemical expertise of our researchers in component development and formulation,” stated Dr. Rainer Hahn, Head of Evonik’s photopolymer market segment in the Additive Manufacturing Innovation Growth Field.

The new lines of photopolymers are ready-to-use, high-performance formulations that can be processed on a wide range of common SLA and DLP machines commercially available on the market.