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Home > News > Machinery & Chemical

ASMPT introduces flagship die bonder, pushing boundaries of miniaturization

Source：Adsale Plastics Network Date ：2025-05-21 Editor ：RC
Copyright： This article was originally written/edited by Adsale Plastics Network (AdsaleCPRJ.com), republishing and excerpting are not allowed without permission. For any copyright infringement, we will pursue legal liability in accordance with the law.

ASMPT, the leading supplier of production equipment for advanced packaging and semiconductor assembly, introduces its flagship INFINITE die bonder with intelligent features to meets even the most challenging requirements in the areas of miniaturization and material properties.


ASMPT_INFINITE die bonder.jpg


ASMPT’s INFINITE bonder.

 

The INFINITE bonder achieves a throughput rate of up to 18,500 UPH with a placement accuracy of ±20 μm @ 3 σ in standard mode and ±12.5 μm @ 3 σ in high-precision mode. In its standard version, the machine can process dies with areas ranging from 0.2 × 0.2 mm to 9 × 9 mm and thicknesses ranging from 0.075 to 1 mm with a bonding force ranging from 0.196 to 29.43 N. The maximum substrate size is 300 × 100 mm.

 

Intelligent features in the die bonder help create the best possible conditions for the application of adhesives. The iSense function inspects each placement area for bumps and warps.

 

Users only need to specify the epoxy resin’s parameters, the desired bond line thickness, and the fillet height to be achieved during the setup phase. All other parameters such as the processing speed, pattern and application height, are automatically determined by the ASMPT AI.

 

The machine optimizes the application of the adhesive over the course of a few test steps with touchless measurements and feedback. Most setups are completed within 30 minutes.

 

With the intelligent iTouch feature, the INFINITE bonder can maintain the programmed bonding forces with exceptional accuracy. This enables the reliable processing of even very thin dies made of highly sensitive materials such as silicon carbide (SiC) and gallium nitride (GaN). The precisely defined and monitored bonding force is ideal for silver-sintering paste and keeps the fillet height within the defined window despite varying process parameters.

 

The INFINITE bonder supports various packaging types, such as BGA, LGA, SiP, MEMS, or QFN. The machine is ideal in many demanding areas like 5G components, high-performance AI chips, safety-critical components for the automobile industry or the medical sector, as well as for high-quality and highly miniaturized consumer products.


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Source：Adsale Plastics Network Date ：2025-05-21 Editor ：RC
Copyright： This article was originally written/edited by Adsale Plastics Network (AdsaleCPRJ.com), republishing and excerpting are not allowed without permission. For any copyright infringement, we will pursue legal liability in accordance with the law.

ASMPT, the leading supplier of production equipment for advanced packaging and semiconductor assembly, introduces its flagship INFINITE die bonder with intelligent features to meets even the most challenging requirements in the areas of miniaturization and material properties.


ASMPT_INFINITE die bonder.jpg


ASMPT’s INFINITE bonder.

 

The INFINITE bonder achieves a throughput rate of up to 18,500 UPH with a placement accuracy of ±20 μm @ 3 σ in standard mode and ±12.5 μm @ 3 σ in high-precision mode. In its standard version, the machine can process dies with areas ranging from 0.2 × 0.2 mm to 9 × 9 mm and thicknesses ranging from 0.075 to 1 mm with a bonding force ranging from 0.196 to 29.43 N. The maximum substrate size is 300 × 100 mm.

 

Intelligent features in the die bonder help create the best possible conditions for the application of adhesives. The iSense function inspects each placement area for bumps and warps.

 

Users only need to specify the epoxy resin’s parameters, the desired bond line thickness, and the fillet height to be achieved during the setup phase. All other parameters such as the processing speed, pattern and application height, are automatically determined by the ASMPT AI.

 

The machine optimizes the application of the adhesive over the course of a few test steps with touchless measurements and feedback. Most setups are completed within 30 minutes.

 

With the intelligent iTouch feature, the INFINITE bonder can maintain the programmed bonding forces with exceptional accuracy. This enables the reliable processing of even very thin dies made of highly sensitive materials such as silicon carbide (SiC) and gallium nitride (GaN). The precisely defined and monitored bonding force is ideal for silver-sintering paste and keeps the fillet height within the defined window despite varying process parameters.

 

The INFINITE bonder supports various packaging types, such as BGA, LGA, SiP, MEMS, or QFN. The machine is ideal in many demanding areas like 5G components, high-performance AI chips, safety-critical components for the automobile industry or the medical sector, as well as for high-quality and highly miniaturized consumer products.


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ASMPT introduces flagship die bonder, pushing boundaries of miniaturization

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