SABIC introduces the latest edition to its LNP THERMOTUF family of specialty compounds – the new LNP THERMOTUF WF0087N compound – the industry’s first nano molding technology (NMT) material based on polybutylene terephthalate (PBT) that combines excellent flame retardancy (FR) and outstanding mechanical performance.

The new LNP THERMOTUF WF0087N compound can be applied in nano molding technology for smartphone middle frame.

The new compound addresses the growing demand across consumer electronics industry for lightweight and durable metal-plastic hybrid components, such as those used in middle frame of smartphones.

Additionally, its FR properties comply with the fourth edition of the IEC 62368-1 safety standard for consumer electronics devices.

More benefits from nano molding technology (NMT)

Nano molding technology (NMT) is a manufacturing process in which plastic resin is injected into a chemically treated metal surface to produce a tightly bonded, hybrid material.

This process can achieve lightweight, thin-wall designs, radio frequency transparency, excellent aesthetics and streamlined processing, compared to die casting and insert molding. Furthermore, NMT helps protect electronic devices from water and dust.

To these benefits, LNP THERMOTUF WF0087N compound adds thin-wall FR (UL94 V0 @ 1.0mm) while maintaining good bonding strength and mechanical properties, such as impact resistance. In fact, its tight bond with metal is about 60% stronger than that of typical FR PBT resins. This property meets the stringent IP68 standard for water and dust protection.

The new grade also offers robust chemical resistance to harsh anodizing treatments and custom colorability for attractive aesthetics. Its dielectric properties help ensure high signal performance in devices with multiple antennas.

Potential applications for the new compound include antenna splitters and other structural components in smartphones, tablets, smart watches and laptops.

LNP THERMOTUF WF0087N compound won the 2025 Edison Award.