Following the integration of Polyplastics and Daicel Group, the company will debut as the “new Daicel” at CHINAPLAS 2026, showcasing latest achievements in material innovation around seven themes.

Booth design of the new Daicel Group at CHINAPLAS 2026.

xEV display area

The area will feature a variety of key components for new energy vehicles made from high-performance materials. It will also present related applications for smart and safe mobility.

High-speed transmission solutions

At the booth, low-dielectric, high-heat resistant resin material will be presented. They are suitable for high-speed data transmission in fields such as servers and high-speed connectors.

Semiconductor solutions

For the semiconductor industry, Daicel will present high-performance material solutions, including LAPEROS LCP for next-generation IC trays and TOPAS COC for advanced wafer carriers.

New materials for the Chinese market

At CHINAPLAS, the company will introduce AURUM (TPI), an ultra-heat-resistant thermoplastic polyimide, and ARLEN PA6T, a high-temperature polyamide from Mitsui Chemicals.

Quality of life applications

Displayed materials meet safety and cleanliness standards for food and drinking water contact, medical devices, and high-purity industrial sectors.

China debut: Specialized 3D printers

A live demonstration of Swiss NEMATX high-performance 3D printer will showcase high-speed printing of high-strength, high-precision, heat-resistant parts using LCP material.

In other cases, a POM-specific 3D printer will be demonstrated, producing high-strength, high-precision, wear-resistant, and dimensionally stable functional parts from POM resin at high speed, highlighting the power of additive manufacturing in engineering plastics.

Sustainability

Low-carbon materials and circular economy solutions will also be highlighted, such as CAFBLO, a recyclable and marine-biodegradable bioplastic, as well as new POM materials containing post-consumer recycled (PCR) content, demonstrating the company’s commitment to sustainable development.

Interactive sessions and concurrent event “TechTalk”

On-site interactive sessions will also be available for guests, giving them the opportunity to learn about the new Daicel Group.

The new Daicel Group will also join concurrent even “TechTalk”. Experts from the company will introduce new TPI and LCP materials for automotive applications under the topic “High-performance materials driving the development of new energy vehicles”. The event will take place on April 23, 3:20-3:40 pm, at Hall 2.2 J80 in NECC, Shanghai, China.