Evonik to display innovations for Chinese emerging markets at CHINAPLAS 2026
Under the theme “WE GO BEYOND WITH plastics solutions”, Evonik will highlights its innovations, tailored for the Chinese market, in sustainability, energy transition, low-altitude economy, smart manufacturing, personalized healthcare, and the circular economy, at CHINAPLAS 2026.

At CHINAPLAS 2026, Evonik will showcase its innovations for various emerging industries under the theme “WE GO BEYOND WITH plastics solutions”.
“Material innovation is the core driving force for industrial development and sustainable transformation. Evonik is committed to breaking the boundaries of material science through cross-industry collaboration and local R&D investment, creating more possibilities for future industrial development,” said Xia Fuliang, President of Evonik Greater China.
Driving breakthroughs in new energy vehicle safety and performance
With China’s new energy vehicle industry expanding rapidly, thermal management has become essential to battery safety and performance.
To especially support this industry, Evonik will display its VESTAMID PA12 materials, which offer excellent chemical resistance and high-temperature performance. These materials are widely used in battery cooling lines, busbars, and energy storage systems, and meet requirements for efficient heat dissipation and long-term stable operation.
Additionally, VESTAMID PA12 also delivers outstanding performance in datacenter cooling systems, and is ideal for supporting infrastructure needed for AI and the digital economy.
Beyond thermal management, Evonik’s innovative materials are also used in core automotive components such as electric drive and transmission systems. A key selection of lightweight and high-performance solutions will be displayed, along with gears manufactured with VESTAKEEP PEEK, which provide an advanced material solution for automotive transmissions, and play a valuable role in supporting the continued development of China’s new energy vehicle industry.
At Evonik’s Shanghai Innovation Park, the newly operational Evonik PEEK Rectangular Magnet Wire Lab will focus on R&D for new energy vehicle motor applications — as well as the further promotion of lightweight and high-performance solutions.
Supporting the ‘low-altitude’ economy and new green aviation scenarios
As a key area in China’s “15th Five-Year Plan”, the low-altitude economy is entering a period of rapid growth.
To address the needs of new aircraft applications such as eVTOLs (electric vertical take-off and landing aircraft), Evonik will showcase its ROHACELL PMI foam. Known for its ultra-light weight and high strength, the material can be used in the design of critical eVTOL structural components. The innovative solution enables both lightweighting and safety, and will help accelerate greener air mobility.
Evonik will also display solutions based on VESTAMID PA12. Thanks to the material’s excellent chemical resistance and high-temperature performance, it is ideal for use in the thermal management systems of low-altitude aircraft. These and other properties help ensure the safe and stable operation of batteries and power systems under extreme conditions, and further enhance aircraft performance and reliability.
Advancing personalized healthcare
In China’s growing personalized healthcare sector, Evonik materials have achieved tangible progress. Patient-matched cranial implants manufactured using Evonik’s VESTAKEEP Fusion filaments have received China’s first registration certificate for medical-grade devices produced with FDM additive manufacturing—marking a major milestone for personalized healthcare in China.
Furthermore, products made from VESTAKEEP i4 3DF for spinal implants have obtained China’s first registration certificate issued by the NMPA, enabling the material to ensure higher safety and precision to orthopedic surgery to the benefit of patients.
Supporting 3D printing manufacturing
In support of China’s additive manufacturing activities, Evonik, a pioneer in polymer 3D printing, will showcase its INFINAM PA12 products, which offer high strength, chemical resistance, and excellent processability.
The material has demonstrated strong potential in precision manufacturing, customized parts, and small-batch production, and is widely used in industries such as automotive, consumer goods, and medical devices. These and other Evonik solutions are ideal for supporting China’s advanced manufacturing industry, as it moves toward smarter and more efficient production.
Unlocking material value for the expanding consumer economy
Addressing the premium consumer goods sector, Evonik will present its VESTAMID PEBA elastomers, which combine lightness in weight, outstanding impact resistance, and flexibility. These properties make VESTAMID PEBA an ideal material for midsoles and outsoles in high-end sports footwear. The elastomers improve comfort and durability, and address brands’ needs for sustainable, high-performance materials.
At CHINAPLAS, Evonik will also showcase melt-blown nonwoven fabrics made from VESTAMID. These filament materials are suitable for applications such as textiles and filtration, with a light feel that supports the production of shoe uppers and premium apparel fabrics.
Accelerating the circular economy and upgrading recycled plastics
Evonik will also showcase its innovative additive solutions for plastics recycling and processing. During mechanical recycling processes, Evonik products such as TEGO CYCLE and TEGO Sorb can effectively remove inks, packaging labels, and residual odors during washing and compounding. This enables the conversion of contaminated plastic waste into high-quality recyclates.
Additionally, Evonik’s TEGO PPA processing aids provide a PFAS-free solution to improve packaging quality and environmental sustainability.
As concurrent event of CHINAPLAS, Evonik will also participate in “Tech Talks – 2026 New Materials” session, featuring an expert from Evonik’s Smart Effects business line, who will deliver a keynote titled “Evonik Silica in plastics industry — Essential, Sustainable, and Safe” at 15:40 on April 21 at Hall 2.2 - J80.