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DSM Engineering Plastics presents Stanyl ForTii for E&E applications

Source: Date :2009-02-12 Editor :(JZ)
Source: Adsale Industry Portal 2456.com

DSM Engineering Plastics, a global supplier of engineering thermoplastics, has unveiled the trade name under which it is to launch its latest high performance polymer for use in electronics and other applications. At a special naming ceremony held this Tuesday (February 10) in Sittard, The Netherlands, DSM Engineering Plastics announced that the new polymer would be known as Stanyl ForTii. Key customers from various industries in the US, Europe and Asia have been involved in the naming process.

As part of the Stanyl family, ForTii (previously announced as PA4T) is a totally new halogen free, flame retardant, high temperature polyamide which extends the portfolio for high performance engineering thermoplastics. Stanyl ForTii offers a step-change with a unique balance of properties to meet today's need for smart innovation. The properties mix includes good dimensional stability, compatibility with lead free reflow soldering, high stiffness and mechanical strength at extreme temperatures. Due to its broad processing window and high flow, Stanyl ForTii has good processability. In proven customer applications, the balance of dimensional stability, high mechanical and thermal performance and low moisture uptake outpaces those of existing polymers.

New Stanyl ForTii joins the outstanding range of Stanyl products and meets market needs for lead free soldered surface mount devices such as circuit boards used in personal computers, as well as the current move towards halogen free electronics. It facilitates the ongoing trend towards further miniaturization, higher data transfer rates and convergence of electronic devices like cell phones, GPS navigators and computers. It will also assist automakers and the aerospace industry in continued weight reduction efforts for better fuel efficiency and lower costs.
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