SABIC expands its production of its specialty oligomers based on polyphenylene ether (PPE) technology, meeting the rapidly growing demand for high-performance printed circuit boards (PCBs) in data centers serving the needs of artificial intelligence (AI) and 5G applications.

SABIC to further expand Its PPE oligomers capacity for PCB laminates to support the rapid growth of AI data centers. (Source: SABIC)

This expansion builds on previous capacity increases in Asia. The further expansion in PPE oligomers is scheduled for completion in the second half of 2026 and will help PCB manufacturers maintain fast lead times as the demand for their products continues to rise.

“As AI is infused into virtually every industry and environment, the data center market needs unique material solutions to support high-speed, high-bandwidth, low-latency infrastructure and deliver new levels of performance and reliability,” said Sergi Monros, vice president, SABIC Polymers, Specialties BU.

Flagship product: NORYL SA9000

SABIC’s flagship in this segment is NORYL SA9000, a modified low-molecular-weight, bi-functional PPE oligomer grade for high-performance multilayer copper-clad laminates (CCLs) used in 5G base stations and high-speed AI server PCBs.

The material combines high heat resistance, dimensional stability and flame retardancy with increased layer-count capability to achieve very low-loss CCL products with enhanced dielectric layer strength.

It offers formulating flexibility in existing CCL production operations and has a proven fit for incorporation in various different solvent-based thermoset systems.

More specialties resin and compounds to offer

Data centers for AI and 5G pack powerful electronics into confined spaces, demanding advanced materials for next-gen design and engineering. Beyond PPE oligomers, SABIC offers a wide range of specialties resin and compounds with unique benefits, lightweight strength, thermal and electrical conductivity, optical clarity, chemical resistance, and cooling capabilities.

These include:

• ULTEM resins: cooling fans, liquid cooling connections, signal connectors, on-board optics

• NORYL resins: air and cable guides

• LNP FARADEX compounds: EMI shielding

• LNP STAT-KON compounds: anti-static components

• LNP ELCRES copolymers: busbar covers