Trelleborg Sealing Solutions will showcase a new range of fluorosurfactant-free seals designed to reduce environmental impact at Silicon Saxony Days 2026 on June 15-17 in Germany.

New Isolast PureFab materials

As global regulators and semiconductor manufacturers increasingly focus on reducing per- and polyfluoroalkyl substances (PFAS) due to their potential impacts on human health and the environment, Trelleborg launches three new Isolast PureFab materials, two per-fluoroelastomers (FFKMs) JPF50 and JPF58, and fluoroelastomer (FKM) VPF20.

Isolast PureFab JPF50 is a high-purity FFKM manufactured without fillers which extends service life and increases yields, meeting the demanding requirements of the semiconductor industry.

Isolast PureFab JPF58 is a high-temperature FFKM delivering purity and performance in challenging semiconductor applications to extend service life.

Isolast PureFab VPF20 – a high-purity FKM – is specifically designed for contamination-free production in semiconductor and flat panel display manufacturing where purity is critical.

The additions expand the extensive Trelleborg range of semiconductor solutions designed to perform and prevent premature failure in the extreme temperatures and more aggressive chemical precursors increasingly characterizing semiconductor environments.

The entire Isolast PureFab range demonstrated at the show includes materials providing excellent performance in aggressive front-end processes including deposition, etch, ash/strip, plasma cleaning and thermal processing such as atomic layer deposition.

More expanded portfolio

Also featured are bonded slit valve door seals for wafer transfer chambers, offering significantly higher performance than conventional O-Rings. Comprised of dynamic rubber-to-metal bonded seals, they are characterized by a longer lifespan and a much more reliable sealing performance. Thanks to their extremely low particle generation and high durability, costly downtime and maintenance intervals are minimized.

Additionally, Trelleborg will showcase chemical mechanical planarization (CMP) parts including liquid silicone rubber (LSR) and high-consistency rubber (HCR) rolling diaphragms used to stabilize the grinding pad and wafer during CMP polishing.