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Home > News > Packaging

Dow partners with Nordmeccanica to develop new flexible packaging technology

Source：Source: CPRJ Editorial Team Date ：2016-02-29 Editor ：(JEN)

US-based The Dow Chemical Company will collaborate with Italian coating, laminating and metallizing machinery supplier Nordmeccanica Spa to develop new solutions for flexible packaging.

Dow's Pack Studios in Mozzate, Italy hosts an industry-scale Nordmeccanica Super Combi 3000 laminator line tailored for Dow's adhesives customers to test and prototype new innovation in packaging lamination. The collaboration will be expanded to other Pack Studios around the world.

Aiming at faster commercialization of new adhesive solutions, Dow and Nordmeccanica are working on joint projects in order to bring several new technologies to market in 2016.

"This formal development agreement reflects another milestone in Dow's strong commitment to the adhesives industry, coupled with the strong participation in the flexible packaging market through our polyethylene and specialty resin offerings," stated Greg Bunker, Dow's Global Business Director for Adhesives for Packaging, Textiles and Hygiene.

"Technology these days is in fact so advanced that innovation is the result of the combined efforts of multiple players. With this strong collaboration we will continue to fuel the growth of the flexible packaging industry that touches almost everyone's life on the planet. This industry is also one of the most significant to drive sustainable packaging development, with the most efficient material usage, as well as reducing food waste along the global food supply chain," added Vincenzo Cerciello, Technical Manager, Nordmeccanica Group.

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Source：Source: CPRJ Editorial Team Date ：2016-02-29 Editor ：(JEN)

US-based The Dow Chemical Company will collaborate with Italian coating, laminating and metallizing machinery supplier Nordmeccanica Spa to develop new solutions for flexible packaging.

Aiming at faster commercialization of new adhesive solutions, Dow and Nordmeccanica are working on joint projects in order to bring several new technologies to market in 2016.