Higher voltages, greater power densities, and ongoing miniaturization are driving manufacturers of critical power electronics to choose materials that enhance stability and performance.

To meet these demands, SABIC has launched a new series of LNP THERMOCOMP compounds optimized for high-power, high-voltage electric drives and power modules, such as insulated-gate bipolar transistor (IGBT) switches.

LNP THERMOCOMP OFM76XXP and OFM76EXP compounds are well suited for high-voltage electric drive and power module applications, such as IGBT power switching devices. 

Based on polyphenylene sulfide (PPS) resin, the new LNP THERMOCOMP OFM76XXP and OFM76EXP compounds deliver excellent impact strength and dimensional stability, a robust comparative tracking index (CTI-PLC 0) and resistance to thermal shock to address increasingly stringent requirements. They also feature high heat resistance, dielectric strength for effective electrical insulation and UL94 V0 flame retardancy (FR).

These high-performance materials are suitable for use in power modules for high-voltage (i.e., 800V and above) electric vehicle traction inverters and fast chargers, as well as renewable energy systems and industrial automation applications such as robotics.

The new LNP THERMOCOMP compounds combine the highest CTI level with excellent strength and insulation performance under thermal aging, but with enhanced toughness. They achieve 90% retention of strength and insulation capability after 1000 hours of heat aging at 200°C.

Compared to polybutylene terephthalate (PBT) and polyphthalamide (PPA) materials, they provide superior dimensional stability and resistance to thermal shock. These new grades support miniaturized, lightweight designs with thin-wall FR capability (UL94 V0 at 0.4mm). Furthermore, they can be produced in white or light colors for visibility of compulsory QR codes printed on IGBTs.

The LNP THERMOCOMP OFM76EXP grade offers enhanced laser marking capability, the highest impact strength of comparable materials, adhesion to silicone-based sealants and crack resistance.

Higher voltages, greater power densities, and ongoing miniaturization are driving manufacturers of critical power electronics to choose materials that enhance stability and performance.

To meet these demands, SABIC has launched a new series of LNP THERMOCOMP compounds optimized for high-power, high-voltage electric drives and power modules, such as insulated-gate bipolar transistor (IGBT) switches.

LNP THERMOCOMP OFM76XXP and OFM76EXP compounds are well suited for high-voltage electric drive and power module applications, such as IGBT power switching devices. 

Based on polyphenylene sulfide (PPS) resin, the new LNP THERMOCOMP OFM76XXP and OFM76EXP compounds deliver excellent impact strength and dimensional stability, a robust comparative tracking index (CTI-PLC 0) and resistance to thermal shock to address increasingly stringent requirements. They also feature high heat resistance, dielectric strength for effective electrical insulation and UL94 V0 flame retardancy (FR).

These high-performance materials are suitable for use in power modules for high-voltage (i.e., 800V and above) electric vehicle traction inverters and fast chargers, as well as renewable energy systems and industrial automation applications such as robotics.

The new LNP THERMOCOMP compounds combine the highest CTI level with excellent strength and insulation performance under thermal aging, but with enhanced toughness. They achieve 90% retention of strength and insulation capability after 1000 hours of heat aging at 200°C.

Compared to polybutylene terephthalate (PBT) and polyphthalamide (PPA) materials, they provide superior dimensional stability and resistance to thermal shock. These new grades support miniaturized, lightweight designs with thin-wall FR capability (UL94 V0 at 0.4mm). Furthermore, they can be produced in white or light colors for visibility of compulsory QR codes printed on IGBTs.

The LNP THERMOCOMP OFM76EXP grade offers enhanced laser marking capability, the highest impact strength of comparable materials, adhesion to silicone-based sealants and crack resistance.