FCS Precision Industry Co., Ltd. has signed a strategic cooperation agreement with Korea-based China Korea Smart Technology (CKST), securing exclusive distribution rights for CKST equipment in Taiwan and Southeast Asia.

FCS and CKST signed an exclusive distribution agreement for CKST’s equipment in Taiwan and Southeast Asia.

The two companies will jointly develop opportunities in glass substrate equipment, a key enabling technology for next-generation AI chips and high-performance computing (HPC) advanced packaging, marking an important step in FCS's semiconductor growth strategy.

Combining Korean core technologies with local service

As demand for large language models and AI computing continues to accelerate, conventional organic substrates such as ABF face increasing challenges in warpage and thermal stress as package sizes grow.

Glass substrates, featuring high rigidity, low warpage, and strong high-frequency electrical performance, are emerging as a promising next-generation solution, although mass production still presents technical challenges.

CKST's core technologies originate from Korea's established semiconductor R&D ecosystem, with extensive expertise and practical experience in glass substrate TGV, VP, VCP, and advanced packaging equipment.

Meanwhile, FCS brings more than five decades of experience in equipment manufacturing and system integration, supported by capabilities in precision manufacturing, automation integration, and global service.

Through this collaboration, the two companies aim to combine their complementary strengths and provide customers across Asia with integrated equipment and localized support.

FCS will introduce the following equipment under the exclusive distribution agreement:

1. Advanced VP Vertical Plating Equipment: Proprietary control technology maintains plating deviation within 3%.

2. High-Speed VCP Vertical Continuous Plating Equipment: Designed for efficient, large-scale mass production.

3. High-Performance SPP Panel-Level Plating Equipment: Covers TGV via filling through mass-production plating applications, providing a comprehensive equipment solution.

Dual-track semiconductor strategy: Advanced components and packaging equipment

Looking ahead, in addition to introducing advanced glass substrate packaging equipment, FCS is advancing a dual-track growth strategy across the semiconductor, ICT, and AI supply chains:

• Growth Engine A — Advanced MLPC Multilayer Solid Capacitors: To address demand from AI servers, GPU accelerator cards, and automotive electronics for high-power, high-voltage, and low-ESR components, FCS plans an initial investment of NT$200 million to establish an AI manufacturing base and advanced MLPC production line, targeting import-substitution opportunities in a market of approximately six billion units annually.

• Growth Engine B — Exclusive distribution of CKST equipment: Through the distribution of TGV, VP, VCP, and other key electroplating systems for advanced semiconductor packaging, FCS aims to serve PCB, IC substrate, and semiconductor packaging and testing customers across Taiwan and Southeast Asia.