Log in
onclick="gourl('https://www.adsalecprj.com/en/auth/register.html')" v-if="!userInfo.id"> Register
Contact
{{userInfo.company_name_english||userInfo.truename_english}}
{{userInfo.phone||userInfo.email}}

Home Page

Member Center

Data Settings

Log out

 
Packaging

Amcor acquires China-based Tian Cai Packaging Company for RMB211 million

Dec 24, 2014

Australia-based packaging group Amcor has agreed to acquire Zhongshan Tian Cai Packaging Company in China for RMB211 million.

Tian Cai, a Chinese flexible packaging business located in Zhongshan, generates approximately RMB280 million per annum. The company offers packaging for the food, beverage and pharmaceutical markets.

Amcor, which currently has three flexible packaging plants in Southern China, said the acquisition will expand broaden Amcor's capabilities within the South China region to include pharmaceutical packaging.

"China is one of the most attractive markets for flexible packaging globally. The Tian Cai acquisition is a strong fit with our existing operations and provides an opportunity to further expand Amcor's customer base and product offering in the South China region," said Amcor's Managing Director and CEO, Ken MacKenzie.

Packaging
Comments
Packaging
The World Packaging Organisation announces the launch of the World Packaging Day (WPD) to be celebrated every year on September 6, marking the anniversary of WPO's foundation.
Sep 9, 2026
Packaging
ACTEGA has invested in a new production facility for sealants at its Foshan site in Guangdong Province, China.
Sep 9, 2026
Packaging
Mentholatum continues to adapt to new cosmetic market demands while keeping safety and stability as its main focus.
Sep 8, 2026
Packaging
Designed for extrusion blow molding, LUXYCLEAR EBM PET 5508 enables thick-wall cosmetic bottles with exceptional clarity and transparency.
Sep 7, 2026
Injection
At Fakuma 2026, Netstal will present the all-electric Elion 3200 CAP for the first time for beverage closure production.
Sep 3, 2026
Packaging
Mitsubishi Chemical Corporation has decided to commercialize a new negative thermal expansion filler developed for semiconductor packaging materials.
Sep 1, 2026
Share Your Choice
Facebook
X
Email