New Print Packaging Technology section to celebrate 20th Eurasia Packaging Fair

The 20th Eurasia Packaging Fair will include a new Print Packaging Technology section, announces the organizer, Reed Tüyap, the joint venture between Reed Exhibitions and Tüyap Fairs Group.

Over 1,200 companies from more than 40 countries are expected to participate at the fair, taking place from September 18-21 in Istanbul, Turkey.

"We are really pleased with how the event is shaping up for this year. Our new Print Packaging Technology has been very well received, and the show overall is 75% full with exhibitors coming from Turkey and around the world," says Berkan ?ner, Project Group Director of Eurasia Packaging Fair. "We have seen great support from ASD, the packaging manufacturers association in Turkey, as well as from AMD, ESD, KASAD, MASD and SEPA, which will once again help us to have a cutting edge professional education program."

According to the organizer, professional buyer groups are being organized from Europe, Asia and Africa.