Polyplastics expands LAPEROS LCP range for electronics industry
Polyplastics Group has expanded its LAPEROS liquid crystal polymer (LCP) product line with the launch of the new LH and TF series materials which meet the electronics market's growing demand for higher performance and miniaturization.
Polyplastics’ LAPEROS LCP is suited for electronics applications.
These new LCP series grades will accelerate expansion into a broader range of applications and next-generation product development through two distinct approaches: versatility in meeting diverse design needs and high flowability.
LH Series
The LH series features well-balanced performance, combining flowability, mechanical properties, and heat resistance. The materials also offer adaptability that can accommodate a broad range of product designs, making them suitable for various electronic component applications.
TF Series
The TF series is engineered for exceptional fluidity for better molding of complex geometries found in smartphones and precision electronic components.
While maximizing flowability, the TF series also maintains excellent mechanical properties and a flexible molding window, providing materials that support miniaturization and high-density integration in electronic devices.
Material Informatics methods to streamline materials development
Polyplastics is leveraging Materials Informatics methods that utilize AI and data analysis to streamline materials development. By analyzing extensive material data accumulated over many years, the company derives optimal properties, enabling shorter development cycles and highly precise designs.
Produced in Japan and Taiwan region in China, LAPEROS LCP has an annual production capacity of 20,000 tons. The high-performance material has long supported advancements in the electronic components sector.
LAPEROS LCP’s exceptional properties, including mechanical strength, heat resistance, and coefficient of linear thermal expansion, are driving its adoption in next-generation, high-speed transmission uses, such as ultra-thin fine-pitch connectors for smartphones and tablet devices.
