Localization of 0.8μm Ultra-Thin Dielectric Coating: JCTIMES Coating Dies Break Core Precision Coating Technology
Addressing Precision Manufacturing Challenges for 0.8μm Ultra-Thin Dielectric Coating
As electronic components shrink and upgrade in performance, 0.8μm ultra-thin dielectric coating has become a critical process for MLCC and other precision electronic manufacturing. Coating uniformity, thickness control accuracy and machine stability directly determine production yield; minor deviations will cause uneven coating layers.
To meet this demand, JCTIMES Group continuously optimizes die head design for high-precision coating processes, supplying stable coating solutions for precision electronics, new energyand advanced materials sectors.
Optimized Flow Channels with Self-Developed 2.5D Analysis Algorithm for Uniform Coating
Coating quality depends on multiple factors including equipment precision, lip curvature, surface finish and straightness. JCTIMES coating dies adopt proprietary 2.5D analysis algorithms combined with precision machining to optimize flow channels and curved die lips, greatly improving transverse coating thickness consistency and delivering uniform, stable coating performance for high-end precision coating applications.
Ultra-Precision Machining Capabilities Support Ultra-Thin Coating Production
High-end coating equipment relies on ultra-precise manufacturing foundations. JCTIMES coating dies achieve:
A) Flatness ≤2μm
B) Straightness ≤1.5μm/m
C) Cavity surface roughness ≤Ra0.02μm
These precision parameters provide solid hardware support for 0.8μm ultra-thin dielectric coating.
The coating dies have completed verification on production lines of leading electronic component manufacturers, with coating uniformity, thickness control precision and operational stability fully meeting the standards for 0.8μm ultra-thin coating. This marks a major milestone for domestic independent development of high-end core coating equipment.
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